view article
Figure 15
Numerical simulation results with for temperature distribution of the foil carrier and copper contact pad with a contact area of 100%.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 29| Part 3| May 2022| Pages 888-895
https://doi.org/10.1107/S1600577522002338
Follow J. Synchrotron Rad.
Sign up for e-alerts
E-alerts
Follow J. Synchrotron Rad. on Twitter
Twitter
Follow us on facebook
Facebook
Sign up for RSS feeds
RSS