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Figure 3
Detail of the readout PCB signal path of the SCIPP assembly, showing the 37 µm-thick diamond sensor, the low-impedance indium band connecting the sensor to the readout network, the series array of 1 Ω and 10 mΩ resistors that shunt the signal to ground, and the two 50 Ω pick-off traces.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
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