Optimizing a photon absorber using conformal cooling channels and additive manufacturing in copper

Chahid, Y.; Atkins, C.; Hodbod, S.; Robinson, J.; Liu, X.; Watson, S.; Jones, M.; Cliffe, M.; Ogunkanmi, D.; Kotlewski, R.; Chapman, L.; Beamish, S.; Linde Cerezo, J.; Wearing, T.; Baroutaji, A.; Arjunan, A.; Fowler, C.; Vivian, P.

doi:10.1107/S1600577525003078

Journal of Synchrotron Radiation Journal of
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Figure 11
Two custom-made benchmark artefacts with support-less pipes and cylinder wall thickness design (left) and another benchmark artefact with teardrop shape pipes and gyroid wall thickness design (right), both 3D printed in copper, using an EOS M290.

JOURNAL OF
SYNCHROTRON
RADIATION

ISSN: 1600-5775

Volume 32| Part 4| July 2025|

https://doi.org/10.1107/S1600577525003078

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