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Figure 1
An illustration of the experimental configuration of i-S3DXRD. (a) A triangular-shaped aluminium block with an angle of Ψ is mounted on the (X, Y, Z)-translation stages. Then, a rotation stage (ω) is mounted on the triangular aluminium block. After mounting a sample holder transparent to X-rays, a Pb-free solder joint is mounted on top of the holder. (b) Two different scan modes are described. In 3D scan mode, (X, Y, Z) stages mounting the triangular block move first, the sample rotates, then the diffraction image is recorded. The sample rotation axis moves together with the (X, Y, Z) stages. In the case of a point-by-point scan mode, the sample stage (xs, ys, zs) moves first, then the sample rotates. Finally, capture the diffraction image. In this configuration, the rotation center does not move. (c) The field of view (FoV) of i-S3DXRD with 3D scan mode defined by the inclination angle and incident X-ray beam trajectories shows the attachment of the double cones sharing the base. (d) A 3D view and a cross-sectional view of the die-attach solder joint specimen are shown. The specimen consists of a solder layer mounted on a DBC substrate, which is covered by a silicon layer. |

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