view article
Figure 8
Comparison of orientation maps obtained by i-S3DXRD and EBSD for the solder sample after 250 thermal cycles. (a) IPF (xs) map, (b) IPF (ys) map, and (c) IPF (ND) map of the first specimen after 250 thermal cycles, measured by EBSD. (d) IPF (xs) map, (e) IPF (ys) map, and (f) IPF (ND) map of the same specimen measured by i-S3DXRD. (g) KAM map calculated from the EBSD data using a cut-off angle of 1°. (h) Angular deviation map evaluated by comparing the EBSD and i-S3DXRD results. (i) Histogram of KAM values obtained from the EBSD map. (j) Statistical distribution of angular deviation derived from (h).

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 33| Part 3| May 2026| Pages 617-631
https://doi.org/10.1107/S1600577526001475
Follow J. Synchrotron Rad.
Sign up for e-alerts
E-alerts
Follow J. Synchrotron Rad. on Twitter
Twitter
Follow us on facebook
Facebook
Sign up for RSS feeds
RSS