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![[Figure 2]](yn5129fig2mag.jpg)
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Figure 2
Top: sensor post fabrication and packaging. Microscope images of pixelated diamond sensor showing a 48 × 48 pixel array. (a) The Au (gold) electrode metallization on a 4.5 mm × 4.5 mm sCVD substrate; (b) the packaged sensor with Au contact metal and wire bonds; (c) the Al (aluminium) electrode metallization; (d) the packaged sensor with Al contact metal and wire bonds. Bottom: transparency of the sensor calculated for 30 and 50 µm-thick diamond capped with aluminium or gold. These values are calculated from tabulated mass attenuation coefficients (https://henke.lbl.gov/optical_constants/filter2.html). The step visible in the gold traces near ≃12 keV corresponds to the Au L-absorption edges while the aluminium capped option does not show such sharp features. A 30 µm diamond sensor with Al contacts is ≲90% transparent by 6.3 keV and ≲95% by 7.9 keV; the thicker 50 µm/Au configuration reaches these transparencies at roughly 9 and 12 keV, respectively. |
![[Figure 2]](yn5129fig2.jpg)
 | JOURNAL OF SYNCHROTRON RADIATION |
ISSN: 1600-5775
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