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Figure 5
Three-dimensional render of ASCANIO sensing head internals, with highlights on the monolithic modules (SDDs), the thermoelectric coolers (TEC), the 3D-printed heat exchanger (WATERBLOCK) and the flexible PCB for connection with the readout board (FLEX PCB).

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 33| Part 5| September 2026| Pages 1467-1477
https://doi.org/10.1107/S1600577526006843