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Figure 3
Scanning electron micrographs of an OSA fabricated out of a 100 m-thick SiC substrate when the PFIB process is realized from the frontside (a) and from the backside (b) of the device. The images are taken during the process from the frontside and after the process from the backside, respectively. |

journal menu![[Figure 3]](ys5112fig3.jpg)
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