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Figure 2
Orientation and deviatoric stress maps for a 0.75 µm-thick Al (0.5% Cu) thin film. Three structures are shown: a 5 ×  5 µm area within an unpassivated pad (a) and passivated lines of width 4.1 µm (b) and 0.7 µm (c). The gray-level differences between grains in the orientation map are correlated to their in-plane orientation.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 10| Part 2| March 2003| Pages 137-143
https://doi.org/10.1107/S0909049502021362
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