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Figure 3
Thermal cycling curve of a 9 × 9 µm area of an Al (0.5% Cu) unpassivated pad. The plot shows the evolution of the average biaxial stress during the process. The inserts show the spatially resolved local stresses on the scanned area at eight different temperatures upon heating and cooling. Because of sample drift, the area of interest had to be repositioned at each temperature and is not exactly identical in each scan. The contour of one particular grain is outlined in each insert.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 10| Part 2| March 2003| Pages 137-143
https://doi.org/10.1107/S0909049502021362
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