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Figure 4
(a) Post-electromigration HVSEM image of a portion of a 1.1 µm-wide Cu line. The dark area in the circle indicates a metal accumulation area. (b) Corresponding grain map obtained by µSXRD. The indices indicate the approximate out-of-plane orientation of some of the grains. (c) Corresponding resolved shear stress map. A high-stress region of 600 MPa is visible in a (111) grain at a boundary of a (115) twin. (d) Width of the (113) reflection of the (111) orientated grain containing the (115) twin versus position along the grain's 2 µm length.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 10| Part 2| March 2003| Pages 137-143
https://doi.org/10.1107/S0909049502021362
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