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Figure 4
Statistics for the consistency of TSV etching. (a) Measured parameters in a cross section. (b, d, f) Histograms of diameter, bottom curvature radius and depth of vias. (c, e, g) Distribution maps of parameters measured from 196 vias.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 27| Part 4| July 2020| Pages 1023-1032
https://doi.org/10.1107/S1600577520005494
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