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Figure 6
Sidewall profile of the TSV etching. (a) Diagram of profile error and sidewall unfolding. (b)–(d) ρ − r maps of vias with fine, medium and poor profile errors. (e) Histogram for RMS value of ρ − r. (f) Distribution map of RMS value for ρ − r among 196 vias.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 27| Part 4| July 2020| Pages 1023-1032
https://doi.org/10.1107/S1600577520005494
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